Temperature resistant from -65☏ to +400☏. Low viscosity system bonds well to a wide variety of substrates. Thermally conductive silicone casting, potting and sealing system. Ideal for bonding similar and dissimilar substrates. One part structural epoxy with high bond strength and excellent adhesion to similar and dissimilar substrates, especially composite materials. High strength one and two component adhesives systems have exceptional peel/shear strength and adhere well to dissimilar substrates with different coefficients of thermal expansion and contraction. Heat dissipative systems are also available for use. They offer high voltage insulation and guard delicate assemblies, heat generating devices and stress sensitive components. Thermal shock resistant potting/encapsulation compounds exhibit low viscosity, toughness, long working life and low exothermic properties. Selecting the proper grade requires careful consideration of: ![]() They are formulated to feature high T g and flexibility to absorb thermally induced stresses. These epoxy, silicone products are designed to ensure that parts, components, devices will perform as necessary upon exposure to severe conditions. Bonding, sealing, potting/encapsulation compounds provide protection against cracking, delamination, leaking, deformation, mechanical failure from rapid extreme temperature fluctuations.
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